Chip cooling with manifold-capillary structures enables 105 COP in two-phase systems
Under a Creative Commons licenseOpen accessHighlights•Embedded two-phase cooling solution for electronic thermal management•Manifold distribution layers efficiently reduce flow resistance compared to microchannels•Capillary structure of micropillar enhances thin-film evaporation•A chip cooling system with a coefficient of performance up to 105SummaryThe exploration of two-phase flow and heat transfer within confined spaces has revealed its potential to mitigate formidable heat dissipation in var...
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