Oki Circuit Technology Co., Ltd.Oki Electric Industry Co., Ltd. Introducing at PCB East 2025 in Massachusetts, USA AI processing requires the transmission of vast data volumes between graphics processing unit (GPU) semiconductors and memory. As semiconductor performance increases, the memory installed is also required to have high-speed, high-frequency, and high-density data transfer capabilities. HBM features a stacked DRAM (*2) structure, requiring technology capable of fabricating wafers even...