1,000 CFETs, SK Hynix Next-Gen NAND, Interconnects Beyond Copper, 2D Materials, and More
It’s an odd time in the chipmaking industry. On one hand, we are ramping into the biggest supercycle ever seen. Advanced logic, DRAM, NAND, customers can’t get enough, chipmakers can’t build capacity fast enough, and we may soon be limited by fab equipment supply. On the other hand, the rapid technology improvement in scaling, power consumption, chip cost, etc. have slowed to a crawl. Massive research efforts yield small incremental gains. As costs increase but improvements asymptote and scaling...
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