AMD Could Enter ARM Market with Sound Wave APU Built on TSMC 3nm Process
AMD is expanding its processor portfolio beyond the x86 architecture with its first ARM-based APU, internally known as “Sound Wave.” The chip’s existence was uncovered through customs import records, confirming several details about its design and purpose. Built with a BGA-1074 package measuring 32 mm × 27 mm, the processor fits within standard mobile SoC dimensions, making it suitable for thin and light computing platforms. It employs a 0.8 mm pitch and FF5 interface, replacing the FF3 socket p...
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