Project Details Project Name:Apple A19 SoC Device:iPhone 17 Category:TeardownDie shot Project Year:September, 2025 Apple A19 SoC die shot These images represent the first high-resolution microscopy of Apple’s A19 chip, extracted from the iPhone 17, revealing its full complexity under the hood. Built on TSMC’s third-generation 3 nm process node—dubbed N3P—the A19 marks a refinement over the earlier N3E technology used in the A18 series, offering higher transistor density, better energy efficiency...